Interconnection Processes and Materials
- 12 November 1990
- journal article
- website
- Published by Institute of Electrical and Electronics Engineers (IEEE) in AT&T Technical Journal
- Vol. 69 (6) , 46-59
- https://doi.org/10.1002/j.1538-7305.1990.tb00486.x
Abstract
The performance of today's electronic and photonic systems is largely limited by interconnection technology. Using silicon-based multichip modules and hybrid optical packaging as exemplary models, we show how high-performance interconnection technology can be achieved at low cost. The key is to choose materials and processes that are compatible with today's very-large-scale integrated-circuit manufacturing.Keywords
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