Precision Grinding and Slicing of Si-Wafers
- 1 January 1993
- book chapter
- Published by Elsevier
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Depth profiling of residual stress along interrupted test cuts in machined germanium crystalsJournal of Applied Physics, 1992
- Abrasive Machining of SiliconCIRP Annals, 1990
- Micro-Raman analysis of stress in machined silicon and germaniumPrecision Engineering, 1988