Kinetics of intermetallic compound formation at 91Sn–8.55Zn–0.45Al lead-free solder alloy/Cu interface
- 3 November 2004
- journal article
- Published by Elsevier in Journal of Alloys and Compounds
- Vol. 381 (1-2) , 162-167
- https://doi.org/10.1016/j.jallcom.2004.03.095
Abstract
No abstract availableKeywords
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