Thermal properties of annular and array geometry semiconductor devices on composite heat sinks
- 31 December 1973
- journal article
- Published by Elsevier in Solid-State Electronics
- Vol. 16 (12) , 1315-1320
- https://doi.org/10.1016/0038-1101(73)90044-0
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
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- Temperature and current distribution in an avalanching p-n junctionSolid-State Electronics, 1968
- The importance of providing a good heat sink for avalanching transit time oscillator diodesProceedings of the IEEE, 1967