Ion beam induced modification of energy of adhesion for copper films on Al2O3 substrates
- 1 January 1987
- journal article
- Published by Elsevier in Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms
- Vol. 19-20, 954-958
- https://doi.org/10.1016/s0168-583x(87)80192-1
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Ion beam bonding of thin filmsNuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1985
- Numerical values of the surface free energies of solid chemical elementsApplied Physics A, 1984
- Scratch adhesion testing of hard coatingsThin Solid Films, 1983
- Measurement of interfacial energy of adhesion by scanning electron microscopyMaterials Science and Engineering, 1973
- Equilibrium shape of a small particle in contact with a foreign substrateActa Metallurgica, 1967