Interfacial chemistry at real resin–metal interfaces of electronics devices
- 1 June 1985
- journal article
- research article
- Published by Wiley in Surface and Interface Analysis
- Vol. 7 (3) , 129-140
- https://doi.org/10.1002/sia.740070305
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- XPS: Energy calibration of electron spectrometers. 2—Results of an interlaboratory comparisonSurface and Interface Analysis, 1984
- XPS: Energy calibration of electron spectrometers. 1—An absolute, traceable energy calibration and the provision of atomic reference line energiesSurface and Interface Analysis, 1984
- ESCA study of the adhesion of Ag, Cu and Ni to polysiloxane resins used in the semiconductor industrySurface and Interface Analysis, 1983
- Adhesion between solid metals: observations of interfacial segregation effects in metal film lubrication experimentsSurface Science, 1983
- Applications of ESCA to fabrication problems in the semiconductor industryApplications of Surface Science, 1982
- Grain boundary segregationJournal of Physics F: Metal Physics, 1980
- Interfacial Fracture Mechanical Aspects of Adhesive Bonded Joints—A ReviewThe Journal of Adhesion, 1979