iTEM: a chip-level electromigration reliability diagnosis tool using electrothermal timing simulation
- 1 January 1996
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
In this paper, we present a new electromigration reliability diagnosis tool (iTEM) for CMOS VLSI circuits. Unlike previous electromigration reliability tools, iTEM can estimate the interconnect temperature rise due to joule heating and heat conduction from the substrate using a newly developed lumped thermal model. Including the temperature effect, iTEM provides more accurate electromigration reliability diagnosis. Moreover, it is very fast and can analyze circuit layouts containing tens of thousands of transistors on a desktop workstation.Keywords
This publication has 15 references indexed in Scilit:
- Wafer-level Jramp and J-constant electromigration testing of conventional and SWEAT patterns assisted by a thermal and electrical simulatorPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Temperature Measurement of Al Metallization and the Study of Black's Model in High Current DensityPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1995
- An electromigration failure model for interconnects under pulsed and bidirectional current stressingIEEE Transactions on Electron Devices, 1994
- Berkeley reliability tools-BERTIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 1993
- The effects of temperature and microstructure on the components of electromigration mass transportPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1993
- AC electromigration characterization and modeling of multilayered interconnectsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1993
- Projecting interconnect electromigration lifetime for arbitrary current waveformsIEEE Transactions on Electron Devices, 1990
- Static temperature distribution in IC chips with isothermal heat sourcesIEEE Transactions on Electron Devices, 1974
- Electromigration failure modes in aluminum metallization for semiconductor devicesProceedings of the IEEE, 1969
- Resistance calculations for thin film patternsThin Solid Films, 1968