Thermomechanical fatigue behavior of Sn-Ag solder joints
- 1 October 2000
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 29 (10) , 1249-1257
- https://doi.org/10.1007/s11664-000-0020-9
Abstract
No abstract availableKeywords
This publication has 15 references indexed in Scilit:
- Analysis of crack growth in solder jointsSoldering & Surface Mount Technology, 1999
- Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder jointsJournal of Electronic Materials, 1999
- Mechanical Behavior of Eutectic Sn-Ag and Sn-Zn SoldersMRS Proceedings, 1995
- Critical Accumulated Strain Energy (Case) Failure Criterion for Thermal Cycling Fatigue of Solder JointsJournal of Electronic Packaging, 1994
- Thermal Fatigue Damage in the Solder Joints of Leadless Chip ResistorsJournal of Electronic Packaging, 1994
- Converting to lead-free solders: An automotive industry perspectiveJOM, 1993
- Modeling of the Thermomechanical Fatigue of 63Sn-37Pb AlloyPublished by ASTM International ,1993
- Thermomechanical Fatigue Life Prediction of 63Sn/37Pb SolderJournal of Electronic Packaging, 1992
- Thermal Fatigue in Solder JointsJOM, 1988
- A microstructural study of the thermal fatigue failures of 60sn-40Pb solder jointsJournal of Electronic Materials, 1988