Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints
- 1 November 1999
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (11) , 1263-1269
- https://doi.org/10.1007/s11664-999-0166-z
Abstract
No abstract availableKeywords
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