Improvement in the adhesion between copper metal and polyimide substrate by plasma polymer deposition of cyano compounds onto polyimide
- 1 January 1996
- journal article
- Published by Taylor & Francis in Journal of Adhesion Science and Technology
- Vol. 10 (3) , 243-256
- https://doi.org/10.1163/156856196x00373
Abstract
The surface modification of Kapton film by means of plasma polymer deposition is discussed from the viewpoint of improving the adhesion between copper metal and Kapton film substrate. Plasma polyme...Keywords
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