Excellent reliability with high throughput techniques and materials for alloy attachment
- 13 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 761-764
- https://doi.org/10.1109/mwsym.1989.38835
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Mechanical properties of In-based eutectic alloy solders used in Josephson packagingCryogenics, 1984
- Soldering to gold filmsGold Bulletin, 1977
- Layer growth in Au-Pb/In solder jointsMetallurgical Transactions A, 1976