Mechanical properties of In-based eutectic alloy solders used in Josephson packaging
- 1 May 1984
- journal article
- Published by Elsevier in Cryogenics
- Vol. 24 (5) , 261-265
- https://doi.org/10.1016/0011-2275(84)90155-3
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Characterization of In-Based Eutectic Alloys Used in Josephson PackagingMetallurgical Transactions A, 1982
- Packaging Technology for Josephson Integrated CircuitsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1982
- A Josephson technology system level experimentIEEE Electron Device Letters, 1981
- Josephson Computer Technology: An IBM Research ProjectIBM Journal of Research and Development, 1980