Inorganic ion beam resist for additive plating of metallic interconnects
- 1 June 1985
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 46 (11) , 1101-1102
- https://doi.org/10.1063/1.95775
Abstract
A new approach to produce metallic conductors on insulating materials is presented. The conductor is made by electroless plating of a catalytic pattern, which is generated by ion beam decompositon of platinum-metal compounds. On polyimide, metallic lines are produced with good adhesion, and it is demonstrated that the lines can be made between two levels. The plating process on polyimide has a surprisingly small inhibition period of 20 s and a plating speed of 30 nm/min which is about twice the normal.Keywords
This publication has 2 references indexed in Scilit:
- AlF3—A new very high resolution electron beam resistApplied Physics Letters, 1984
- Self-confined metallic interconnects for very large scale integrationApplied Physics Letters, 1984