Excimer laser planarization of AlSi, AlSiTi and AlSiCu alloys
- 1 December 1989
- journal article
- Published by Elsevier in Applied Surface Science
- Vol. 43 (1-4) , 264-270
- https://doi.org/10.1016/0169-4332(89)90223-7
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
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- High-aspect-ratio via-hole filling with aluminum melting by excimer laser irradiation for multilevel interconnectionIEEE Electron Device Letters, 1987
- Planarization of gold and aluminum thin films using a pulsed laserIEEE Electron Device Letters, 1986
- Layered and homogeneous films of aluminum and aluminum/silicon with titanium and tungsten for multilevel interconnectsIEEE Transactions on Electron Devices, 1985