Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)
- 1 June 1997
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 119 (2) , 85-88
- https://doi.org/10.1115/1.2792224
Abstract
Moisture migration in PQFPs (plastic quad flat packages) was investigated analytically and experimentally. Coupons made of the molding compound material were exposed to humid air for an extended time to determine its equilibrium moisture composition as a function of environmental moisture level. An IR (infrared) heating test was designed to simulate the high-temperature heat reflow process when PQFPs are soldered on computer boards. The C-SAM (C-mode Scanning Acoustic Microscopy) technique was employed to measure the delaminated areas. All packages failed after IR heating when the moisture content in PQFPs was higher than 60 percent of the equilibrium composition.Keywords
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