The dislocation structure of GaP crystals after 6–10° bending

Abstract
More than one thousand individual dislocations have been examined by TEM in S-doped LEC-GaP after three-point bending of (001) wafers at temperatures in the range 605-615°C. A linear variation of dislocation density with bending angle between 6° and 10° is observed. The role of different dislocation types is investigated. An increasing proportion of 60° dislocations in {111} planes develops during bending. Macroscopic curvature is discussed in terms of the dislocation density observed. Resolved shear stresses are derived from slip-band observation.

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