Low-temperature recovery creep of a Cu-SiO2alloy
- 1 April 1980
- journal article
- research article
- Published by Taylor & Francis in Philosophical Magazine A
- Vol. 41 (4) , 615-618
- https://doi.org/10.1080/01418618008239337
Abstract
Recovery creep, brought about by the accumulation of Orowan loops due to plastic deformation and their annihilation, has been studied in a Cu-SiO2 alloy. A fourth-power dependence of the stationary creep rate on the particle size, and a linear dependence on the applied stress, has been confirmed, in agreement with an analysis in which the annihilation of Orowan loops is considered to be due to their climb caused by dislocation pipe diffusion.Keywords
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