On-chip decoupling zone for package-stress reduction
- 24 June 1991
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
The authors report the reduction of package stresses by introducing a decoupling zone directly around a sensor structure. Different geometries of the decoupling zones are compared, using the finite element method (FEM) and analytical models. Reduction factors over 1000 and higher can be realized by using an axisymmetrical V-corrugation. A design rule to optimize the reduction for the V-corrugation is given. This rule is based on analytical calculations and verified by FEM-simulations. Finally, it is shown that the thickness of a backplate, mounted to the sensor chip, can be optimized for minimal thermal stresses in the sensorKeywords
This publication has 3 references indexed in Scilit:
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- How to liberate integrated sensors from encapsulation stressSensors and Actuators A: Physical, 1990
- Novel Stress Free Assembly Technique for Micromechanical DevicesPublished by Springer Nature ,1990