Fatigue in thin films: lifetime and damage formation
- 6 December 2001
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 319-321, 919-923
- https://doi.org/10.1016/s0921-5093(01)00990-x
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- High cycle fatigue of thin silver films investigated by dynamic microbeam deflectionScripta Materialia, 1999
- A new method to study cyclic deformation of thin films in tension and compressionJournal of Materials Research, 1999
- Tension-tension fatigue of copper thin filmsInternational Journal of Fatigue, 1998
- Size effects in materials due to microstructural and dimensional constraints: a comparative reviewActa Materialia, 1998
- Low cycle fatigue of thin copper foilsThin Solid Films, 1996
- Microstructural development during fatigue of copper foils 20–100 μm thickMaterials Science and Engineering: A, 1994
- Separation of film thickness and grain boundary strengthening effects in Al thin films on SiJournal of Materials Research, 1992
- High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film StructureJournal of Electronic Packaging, 1991
- Mechanical properties of thin filmsMetallurgical Transactions A, 1989
- Annihilation of dislocations during tensile and cyclic deformation and limits of dislocation densitiesPhilosophical Magazine A, 1979