The effect of interdiffusion on the growth mode of copper on Al{111}
- 30 April 1985
- journal article
- Published by Elsevier in Surface Science
- Vol. 152-153, 262-269
- https://doi.org/10.1016/0039-6028(85)90152-9
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Recent advances in epitaxyPublished by Elsevier ,2002
- Interdiffusion in copper–aluminum thin film bilayers. I. Structure and kinetics of sequential compound formationJournal of Applied Physics, 1983
- Photoemission spectra and band structures ofband metals. IX. Triangulation analysis of angle-resolved data on copperPhysical Review B, 1982
- Auger Electron Spectroscopy of fcc Metal SurfacesJournal of Applied Physics, 1968