Monitoring cure of autoclave‐molded parts by dielectric analysis
- 1 April 1982
- journal article
- Published by Wiley in Polymer Composites
- Vol. 3 (2) , 59-64
- https://doi.org/10.1002/pc.750030203
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- High temperature dielectric study of epoxy resinsPolymer Engineering & Science, 1980
- The use of automatic dielectrometry for autoclave moulding of low void compositesComposites, 1974