Reliability indicators for lift-off of bond wires in IGBT power-modules
- 29 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1863-1866
- https://doi.org/10.1109/esref.1996.888233
Abstract
The concept of reliability indicators will be applied to one of the most important life time limiting factors of IGBT modules, the bond wire lift-off. The existence of two sets of reliability indicators based on the measurement of bond wire resistance and collector emitter-voltage is shown. Technical applications for these indicators are discussed.Keywords
This publication has 2 references indexed in Scilit:
- Accelerated ageing with in situ electrical testing: A powerful tool for the building‐in approach to quality and reliability in electronicsQuality and Reliability Engineering International, 1994
- Reliability indicatorsQuality and Reliability Engineering International, 1986