Interdiffusion of an Au/Ni/Cr multilayer metallization on silicon substrates
- 1 June 1989
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 173 (1) , 39-51
- https://doi.org/10.1016/0040-6090(89)90535-x
Abstract
No abstract availableThis publication has 11 references indexed in Scilit:
- Interdiffusion of Au/Ni/cr on Silicon SubstrateMRS Proceedings, 1988
- Sputtered W–N diffusion barriersJournal of Vacuum Science & Technology A, 1985
- Auger study of Cr/Au thin films deposited on alumina and sapphireThin Solid Films, 1980
- The increase in the electrical resistance of heat-treated Au/Cr filmsThin Solid Films, 1980
- Investigation of the electronic structure of La1−x(M2+)xCrO3, Cr2O3 and La2O3 by X-ray photoelectron spectroscopyJournal of Physics and Chemistry of Solids, 1980
- A LEED-AES study of the oxidation of cr(110) and Cr(100)Surface Science, 1973
- Interdiffusion in thin conductor films — chromium/gold, nickel/gold and chromium silicide/goldMetallurgical Transactions, 1971
- Auger electron spectroscopy and inelastic electron scattering in the studies of metal surfacesJournal of Colloid and Interface Science, 1970
- Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline TargetsPhysical Review B, 1969
- Mechanism of Gold Diffusion into SiliconJournal of Applied Physics, 1964