High-frequency inductance measurements and characterization of alloy 42 and copper packages
- 30 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Package inductance measurement at high frequenciesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Lead inductance of ferromagnetic materials and a method to reduce inductance at low frequenciesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A review of the skin effect as applied to thin film interconnectionsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992