The temperature dependence of stresses in aluminum films on oxidized silicon substrates
- 1 January 1978
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 48 (1) , 117-126
- https://doi.org/10.1016/0040-6090(78)90337-1
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Evolution and Current Status of Aluminum MetallizationJournal of the Electrochemical Society, 1976
- A Review of the Limitations of Aluminum Thin Films on Semiconductor DevicesIEEE Transactions on Parts, Hybrids, and Packaging, 1975
- Hillock growth in thin filmsJournal of Applied Physics, 1974
- Strain-relaxation in thin films on substratesActa Metallurgica, 1974
- Control of Resistivity, Microstructure, and Stress in Electron Beam Evaporated Tungsten FilmsJournal of Vacuum Science and Technology, 1973
- Calculated elastic constants for stress problems associated with semiconductor devicesJournal of Applied Physics, 1973
- Mechanisms of Stress Relief in Polycrystalline FilmsIBM Journal of Research and Development, 1969
- Stabilization of SiO2 Passivation Layers with P2O5IBM Journal of Research and Development, 1964