Effects of Solder Creep on Optical Component Reliability
- 1 September 1986
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 9 (3) , 265-271
- https://doi.org/10.1109/tchmt.1986.1136649
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Experimental constitutive relations for the high temperature deformation of a PbSn eutectic alloyMaterials Science and Engineering, 1981
- Efficient laser diode to single-mode fiber coupling using a combination of two lenses in confocal conditionIEEE Journal of Quantum Electronics, 1981
- A comprehensive review of the lognormal failure distribution with application to LED reliabilityMicroelectronics Reliability, 1978