High solder joint reliability with lead free solders

Publisher Website

22 June 2004

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/ectc.2003.1216296

Abstract

No abstract available

Keywords

This publication has 1 reference indexed in Scilit:

Chip Scale Package (CSP) solder joint reliability and modeling
Microelectronics Reliability, 1999