Chip-Module Package Interfaces
- 1 September 1978
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 1 (3) , 305-309
- https://doi.org/10.1109/tchmt.1978.1135287
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Impact of the LSI on High-Speed Computer PackagingIEEE Transactions on Computers, 1978
- On a Pin Versus Block Relationship For Partitions of Logic GraphsIEEE Transactions on Computers, 1971
- Reliability of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969
- Geometric Optimization of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969