An optimal neural network plasma model: a case study

This publication has 13 references indexed in Scilit:

• Use of neural networks to model low-temperature tungsten etch characteristics in high density SF6 plasma
  Journal of Vacuum Science & Technology A, 2000
• Characterizing metal-masked silica etch process in a CHF3/CF4 inductively coupled plasma
  Journal of Vacuum Science & Technology A, 1999
• Modeling magnetically enhanced RIE of aluminum alloy films using neural networks
  IEEE Transactions on Semiconductor Manufacturing, 1998
• The sample complexity of pattern classification with neural networks: the size of the weights is more important than the size of the network
  IEEE Transactions on Information Theory, 1998
• How initial conditions affect generalization performance in large networks
  IEEE Transactions on Neural Networks, 1997
• Randomness in generalization ability: a source to improve it
  IEEE Transactions on Neural Networks, 1996
• Reactive ion etch modeling using neural networks and simulated annealing
  IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, 1996
• An optimal neural network process model for plasma etching
  IEEE Transactions on Semiconductor Manufacturing, 1994
• Advantages of plasma etch modeling using neural networks over statistical techniques
  IEEE Transactions on Semiconductor Manufacturing, 1993
• Statistical experimental design in plasma etch modeling
  IEEE Transactions on Semiconductor Manufacturing, 1991