Automatic generation of a 3-D solid model of a microfabricated structure
- 1 January 1990
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
The automatic construction of a 3-D solid model from a specification of mask layout and process sequence is demonstrated. The process sequence consists of planar deposition and masked etch. The generated 3-D solid model is directly usable by mechanical CAD software and is used to do a deformation analysis of the structure. An overview of the CAD system is given, and the structure simulator is described in detail.Keywords
This publication has 9 references indexed in Scilit:
- A CAD architecture for microelectromechanical systemsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Integrating semiconductor process design and manufacture using a unified process flow representationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- OYSTER, a three-dimensional structural simulator for microelectromechanical designSensors and Actuators, 1989
- Shaping geometric objects by cumulative translational sweepsIBM Journal of Research and Development, 1987
- An Overview of Analytic Solid ModelingIEEE Computer Graphics and Applications, 1985
- VLSI Process modeling—SUPREM IIIIEEE Transactions on Electron Devices, 1983
- A general simulator for VLSI lithography and etching processes: Part II—Application to deposition and etchingIEEE Transactions on Electron Devices, 1980
- A general simulator for VLSI lithography and etching processes: Part I—Application to projection lithographyIEEE Transactions on Electron Devices, 1979
- The tension of metallic films deposited by electrolysisProceedings of the Royal Society of London. Series A, Containing Papers of a Mathematical and Physical Character, 1909