The effect of mechanical constraint on the flow and fracture of 63/37 Sn/Pb eutectic alloy
- 1 November 1995
- journal article
- Published by Elsevier in Engineering Fracture Mechanics
- Vol. 52 (4) , 647-669
- https://doi.org/10.1016/0013-7944(95)00035-t
Abstract
No abstract availableThis publication has 14 references indexed in Scilit:
- On numerically accurate finite element solutions in the fully plastic rangePublished by Elsevier ,2003
- The growth of Cu-Sn intermetallics at a pretinned copper-solder interfaceMetallurgical Transactions A, 1992
- Grain boundary sliding in surface mount solders during thermal cyclingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991
- Fatigue Properties of Microelectronics Solder JointsJournal of Electronic Packaging, 1991
- Thermal fatigue life of Pb-Sn alloy interconnectionsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991
- Thermal Stress Analysis of SMT PQFP Packages and InterconnectionsJournal of Electronic Packaging, 1989
- Phenomenological Modeling of Hardening and Thermal Recovery in MetalsJournal of Engineering Materials and Technology, 1988
- Tensile behavior of pb-sn solder/cu jointsJournal of Electronic Materials, 1987
- Constitutive Equations for Elastic-Viscoplastic Strain-Hardening MaterialsJournal of Applied Mechanics, 1975
- The influence of a limiting dislocation flux on the mechanical response of polycrystalline metalsInternational Journal of Solids and Structures, 1974