Vertical signal transmission in three-dimensional integrated circuits by capacitive coupling
- 19 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 37-40
- https://doi.org/10.1109/iscas.1995.521445
Abstract
In this paper, methods for direct vertical transmission of digital signals between adjacent chiplayers in three-dimensional circuit structures are presented. Alternative circuit schemes are investigated and compared to state-of-the-art structures with respect to signal delay and power dissipation. Improvements of over 30% in terms of speed and up to an order of magnitude in terms of dynamic power dissipation are achievable. Analytical calculations, simulations and experimental results show the suitability of the architectures for vertical signal transmission of high bandwidth digital information.Keywords
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