Variations in Young's modulus and intrinsic stress of LPCVD-polysilicon due to high-temperature annealing
- 1 June 1995
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 5 (2) , 121-124
- https://doi.org/10.1088/0960-1317/5/2/016
Abstract
No abstract availableKeywords
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