Molecular Design of Free Volume as a Route to Low-κ Dielectric Materials

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Abstract
Polymers incorporating the triptycene subunit were prepared for the molecular-level design of low dielectric constant (low-κ) materials that can be used to manufacture faster integrated circuits. Triptycenes having restricted rotation by multiple point attachment to the polymer backbone are shown to introduce free volume into the films, thereby lowering their dielectric constants. The triptycene containing polymers exhibit a number of desirable properties including low-water absorption and high thermal stability. Systematic studies wherein comparisons are made between two separate classes of triptycene polymers and their non-triptycene containing analogues demonstrate that proper insertion of triptycenes into a polymer backbone can give rise to a reduction in the material's dielectric constant while also improving its mechanical properties. These characteristics are desired by the semiconductor industry for the next generation of microprocessors and memory to provide insulation of the increasingly shrinking features.