High-performance interconnects: an integration overview
Top Cited Papers
- 1 May 2001
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Proceedings of the IEEE
- Vol. 89 (5) , 586-601
- https://doi.org/10.1109/5.929646
Abstract
The Information Revolution and enabling era of silicon ultralarge-scale integration (ULSI) have spawned an ever-increasing level of functional integration on-chip, driving a need for greater circuit density and higher performance. While traditional transistor scaling has thus far met this challenge, interconnect scaling has become the performance-limiting factor for new designs. The increasing influence of interconnect parasitics on crosstalk noise and R(L)C delay as well as electromigration and power dissipation concerns have stimulated the introduction of low-resistivity copper and low-permittivity (k) dielectrics to provide performance and reliability enhancement. Integration of these new materials into integrated circuit fabrication is a formidable task, requiring material, process, design, and packaging innovations. Additionally, entirely new technologies such as RF and optical interconnects may be required to address future global routing needs and sustain performance improvement.Keywords
This publication has 24 references indexed in Scilit:
- The projected power consumption of a wireless clock distribution system and comparison to conventional distribution systemsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Full copper wiring in a sub-0.25 μm CMOS ULSI technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A high performance 1.8 V, 0.20 μm CMOS technology with copper metallizationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Wireless interconnection in a CMOS IC with integrated antennasPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Multi-I/O and reconfigurable RF/wireless interconnect based on near field capacitive coupling and multiple access techniquesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- RF/wireless interconnect for inter- and intra-chip communicationsProceedings of the IEEE, 2001
- Wafer Bonding and Layer Splitting for MicrosystemsAdvanced Materials, 1999
- Multiple layers of silicon-on-insulator for nanostructure devicesJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1999
- Multiple layers of silicon-on-insulator islands fabrication by selective epitaxial growthIEEE Electron Device Letters, 1999
- 3-D integration of MQW modulators over active submicron CMOS circuits: 375 Mb/s transimpedance receiver-transmitter circuitIEEE Photonics Technology Letters, 1995