Effect of temperature on isothermal fatigue of solders
- 4 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Isothermal fatigue of low tin lead based solderMetallurgical Transactions A, 1988
- Solder Fatigue Problems in Power PackagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Fatigue: A complex subject—Some simple approximationsExperimental Mechanics, 1965