Reaction Mechanism of Chemical Vapor Deposition Using Tetraethylorthosilicate and Ozone at Atmospheric Pressure
- 1 September 1992
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 31 (9R)
- https://doi.org/10.1143/jjap.31.2925
Abstract
The decomposition process of tetraethylorthosilicate (TEOS) and ozone at atmospheric pressure was measured in a closed vessel by in-situ Fourier-transform infrared absorption (FT-IR) analysis, and the changes of the deposition rate and the overall sticking probability β of the film precursor were obtained along the flow direction in a flow-type reactor. It has been found that the film precursors are formed by TEOS decomposition with O-atoms and/or ozone in the gas phase, and that CH3CHO may be the first product, followed by the oxidation to CO2 and H2O via HCHO. It is also shown that the film quality changes along the flow direction, that is, O-H bonds in the film decrease and the β-value increases as the reaction proceeds. These results may show that there are several kinds of precursors, and the sticky (unstable) precursors become dominant in the later stages.Keywords
This publication has 12 references indexed in Scilit:
- Study of Surface Reaction Probability of CFx Radicals by Trench Deposition MethodJapanese Journal of Applied Physics, 1991
- Film Characteristics of APCVD Oxide Using Organic Silicon and OzoneJapanese Journal of Applied Physics, 1991
- A Study on the Behavior of SiO2 Film Precursors with Trench Deposition Method for SiH4/O2 Low Pressure Chemical Vapor DepositionJapanese Journal of Applied Physics, 1991
- Determination of Surface Reaction Rate Constant by Using Micro-Trench Method in APCVD.KAGAKU KOGAKU RONBUNSHU, 1991
- Silicon Dioxide Deposition by Atmospheric Pressure and Low‐Temperature CVD Using TEOS and OzoneJournal of the Electrochemical Society, 1990
- Decomposition Chemistry of TetraethoxysilaneJournal of the American Ceramic Society, 1989
- A Study on Radical Fluxes in Silane Plasma CVD from Trench Coverage AnalysisJapanese Journal of Applied Physics, 1989
- Electrical properties of silicon dioxide films fabricated at 700°C. I: Pyroltsis of tetraethoxysilaneJournal of Electronic Materials, 1985
- The Deposition of Silicon Dioxide Films at Reduced PressureJournal of the Electrochemical Society, 1979
- Arrhenius constants for the reactions of ozone with ethylene and acetyleneInternational Journal of Chemical Kinetics, 1969