Thermal performance limits of the QFP family
- 1 January 1994
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 17 (4) , 573-582
- https://doi.org/10.1109/95.335044
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Surface-mount plastic packages-an assessment of their thermal performanceIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Package thermal resistance model: dependency on equipment designIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988