An Approach for Evaluating Epoxy Adhesives for Use in Hybrid Microelectronic Assembly

Publisher Website

1 December 1975

journal article
Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging

Vol. 11 (4) , 305-311
https://doi.org/10.1109/tphp.1975.1135081

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Evaluation of Electrically Insulative Adhesives for Use in Hybrid Microcircuit Fabrication
IEEE Transactions on Parts, Hybrids, and Packaging, 1973
Apparatus for Determining the Thermal Conductivity of Solids in the Temperature Range from 20 to 200°C
Review of Scientific Instruments, 1963