Feasibility of BCB as an interlevel dielectric in integrated circuits
- 1 August 1994
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 23 (8) , 819-825
- https://doi.org/10.1007/bf02651378
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- Benzocyclobutene as a planarization resin for flat panel displaysPublished by SPIE-Intl Soc Optical Eng ,1992
- Damascene stud local interconnect in CMOS technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1992
- A fully planarized multilevel interconnection technology using selective TEOS-Ozone APCVDPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1992
- Benzocyclobutenes: A New Class of High Performance PolymersJournal of Macromolecular Science: Part A - Chemistry, 1991
- Benzocyclobutene (BCB) dielectrics for the fabrication of high density, thin film multichip modulesJournal of Electronic Materials, 1990
- Moisture Uptake of Bisbenzocyclobutene (BCB) Films for Electronic Packaging ApplicationsMRS Proceedings, 1990
- The microstructure of metal–polyimide interfacesJournal of Vacuum Science & Technology A, 1988
- Diffusion of Metals in Silicon DioxideJournal of the Electrochemical Society, 1986
- Optimal interconnection circuits for VLSIIEEE Transactions on Electron Devices, 1985
- Effect of scaling of interconnections on the time delay of VLSI circuitsIEEE Transactions on Electron Devices, 1982