Mechanism of twinning-induced grain boundary engineering in low stacking-fault energy materials
- 1 November 1999
- journal article
- Published by Elsevier in Acta Materialia
- Vol. 47 (15-16) , 4187-4196
- https://doi.org/10.1016/s1359-6454(99)00277-3
Abstract
No abstract availableKeywords
This publication has 18 references indexed in Scilit:
- Grain-boundary plane reorientation in copperPhilosophical Magazine A, 1999
- Weak-beam transmission electron microscopy study of dislocation accommodation processes in nickel Σ = 3 grain boundariesPhilosophical Magazine A, 1998
- Overview No. 127The role of the grain boundary plane in cubic polycrystalsActa Materialia, 1998
- Toward Optimization of the Grain Boundary Character Distribution in OFE CopperScripta Materialia, 1998
- “Fine tuning” at Σ3n boundaries in nickelActa Materialia, 1997
- The incidence of symmetric tilt grain boundaries in polycrystalline thin films of goldScripta Materialia, 1996
- Influence of grain boundary character distribution on sensitization and intergranular corrosion of alloy 600Scripta Metallurgica et Materialia, 1995
- Torque-related lamellar carbide growth associated with annealing twins in 304 stainless steelActa Metallurgica et Materialia, 1995
- Crystallographic characterization of planes in the scanning electron microscopeMaterials Characterization, 1995
- Toughening of Brittle Materials by Grain Boundary Design and ControlMaterials Science Forum, 1993