Effect of strain rate on fatigue of low-tin lead-base solder
- 13 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 273-276
- https://doi.org/10.1109/ecc.1989.77761
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- On fatigue life prediction under conditions of tensile holdScripta Metallurgica, 1987
- Solder Fatigue Problems in Power PackagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984