UV-LIGA: a promising and low-cost variant for microsystem technology
- 28 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- One-mask procedure for the fabrication of movable high-aspect-ratio 3D microstructuresJournal of Micromechanics and Microengineering, 1998
- Dreidimensionaler Chip-BeschleunigungssensorTM - Technisches Messen, 1998
- LIGA and related technologies for industrial applicationSensors and Actuators A: Physical, 1996