Reliability of thermo-setting anisotropically conductive adhesives in Chip on Glass application
- 1 March 1995
- journal article
- Published by Springer Nature in Microsystem Technologies
- Vol. 2 (1) , 32-37
- https://doi.org/10.1007/bf02739526
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Development Of "The Maple Method"Published by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Chip on glass technology for large capacity and high resolution LCDPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Joining of displays using thermosetting anisotropically conductive adhesivesJournal of Electronics Manufacturing, 1993
- Reliability of Surface‐mounted Anisotropically Conductive Adhesive JointsCircuit World, 1993