Integration and Packaging of a Macrochip With Silicon Nanophotonic Links
- 13 January 2011
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Journal of Selected Topics in Quantum Electronics
- Vol. 17 (3) , 546-558
- https://doi.org/10.1109/jstqe.2010.2091674
Abstract
The technologies associated with integration and packaging have a significant impact on the overall system. In this paper, we review a silicon photonic “macrochip” system and its associated packaging that will allow dense wavelength-division multiplexed optical links to be intimately integrated and co-manufactured with the switching electronics. For this to happen, we anticipate a number of integration and packaging advances.Keywords
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