Curl‐free high‐adhesion polyimide/copper laminate
- 28 February 1994
- journal article
- research article
- Published by Wiley in Journal of Applied Polymer Science
- Vol. 51 (9) , 1647-1652
- https://doi.org/10.1002/app.1994.070510914
Abstract
6‐Amino‐2‐(p‐aminophenyl) benzimidazole (BIA) was synthesized and empolyed as a diamine component in the preparation of polyamic acid. The mechanical and thermal properties of polyimides made from BIA as a diamine component were investigated. A highadhesion, curl‐free polyimide/copper laminate has been obtained by using BIA as a diamine component. © 1994 John Wiley & Sons, Inc.Keywords
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