An attachment to SEM for 3‐D surface topography measurements of uniform materials

Abstract
The paper reports on a SEM‐based system for quantitative three‐dimensional (3‐D) surface topography measurements. In comparison with commercial line‐width measuring systems, this metrology instrument is designed to measure quantitatively both critical dimensions in horizontal plane and features height while allowing for full cross section reconstruction from backscattered electrons (BSE) signal. The philosophy behind this technique has been described previously, (Aristov et al. 1988, 1991). Now the system is operational at our Institute, and its characteristics just as design criteria, and some examples of application are presented.