Variable-flow microvalve structure fabricated with silicon fusion bonding
- 1 January 1990
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
The combination of silicon fusion bonding fabrication technology and detailed finite-element modeling is used to provide a framework for implementing a new concept in silicon microvalves. The device described is specifically designed for potential use in a current-to-pressure converter. The pressure inside the expansion chamber is controlled by adjusting the flow rate in a leakage path between the orifice and the chamber. Flow rate is regulated by a small valve, typically electromagnetically or piezoelectrically actuated, at flow rates of about 20 cm/sup 3//s. When the valve is fully open, the pressure in the chamber is minimized (3 psi); when the valve is closed, the pressure in the chamber is maximized (15 psi). Optimization of design features using finite-element analysis increased the deflection capability of the valve flapper by at least a factor of 5, over +or-75 mu m.Keywords
This publication has 3 references indexed in Scilit:
- Silicon fusion bonding for pressure sensorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- A constant flow-rate microvalve actuator based on silicon and micromachining technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Micromachined silicon microvalvePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002