Detection of junction failures and other defects in silicon and III–v devices using the LBIC technique in lateral configuration
- 15 December 1996
- journal article
- Published by Elsevier in Materials Science and Engineering: B
- Vol. 42 (1-3) , 208-212
- https://doi.org/10.1016/s0921-5107(96)01708-4
Abstract
No abstract availableKeywords
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