Transient analysis of board-level drop response of lead-free chip-scale packages with experimental verifications

Publisher Website

7 March 2005

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/eptc.2004.1396697

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Free drop test simulation for portable IC package by implicit transient dynamics FEM
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2004
Drop impact test - mechanics & physics of failure
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003